Applications such as high performance computing and
low-power electronics, both needed for artificial intelligence (AI), require
leap-ahead advances in semiconductor advanced packaging. This Notice of Funding
Opportunity (NOFO) seeks proposals for R&D activities that will establish
and accelerate domestic semiconductor advanced packaging through investments in
five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process
Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology,
including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5)
Co-design/Electronic Design Automation (EDA).

Award Project Period: 5 years

Anticipated funding: CHIPS R&D anticipates making
available up to approximately $1,550,000,000 for funding multiple awards of
varying size and scope, with anticipated amounts ranging from approximately
$10,000,000 to approximately $150,000,000 in Federal funds per award over a
five (5) year period of performance.

Cost sharing: Strongly encouraged but not required.

Eligible Applicants: Eligible applicants may submit only
one concept paper per R&D area. Each concept paper may only include one
R&D Area.

Full proposal: Full applications will be due 60 days from
the date of invitation.