Office of Research, UC Riverside
Search Funding

Program TitleNational Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates (2024-NIST-CHIPS-NAPMP-01)
Program WebsiteLink
AgencyNIST/DOC
Number of Submissions Allowed1
Internal UCR Deadline3/21/2024
Intent Deadline4/12/2024
Agency Final Deadline7/3/2024


This NOFO seeks applications for research and development
activities that will establish and accelerate domestic capacity for advanced
packaging substrates and substrate materials. Through this NOFO, the NAPMP
program seeks to achieve the following objectives:



(1) Accelerate domestic R&D and innovation in
advanced packaging materials and substrates;



(2) Translate domestic materials and substrate innovation
into U.S. manufacturing, such that these technologies are available to U.S.
manufacturers and customers, including to significantly benefit U.S. economic
and national security;



(3) Support the establishment of a robust, sustainable,
domestic capacity for advanced packaging materials and substrate R&D,
prototyping, commercialization, and manufacturing; and



(4) Promote a skilled and diverse pipeline of workers for
a sustainable domestic advanced packaging industry.

Multi-year funding policy: When an application for a
multi-year award is approved, funding will be provided only for the first phase
of the project; additional phases will be funded incrementally. If a project is
selected for funding, CHIPS R&D has no obligation to provide any additional
funding in connection with that award. Funding for subsequent phases of a
project will be contingent upon satisfactory performance, continued relevance
to the mission, goals, and priorities of the CHIPS Research and Development
Office, and the availability of funds.

Anticipated Amounts: In FY24, CHIPS R&D anticipates
making available approximately $300,000,000 for funding multiple awards.
Individual awards will be funded in amounts up to approximately $100,000,000
and over a period of up to 5 years per award, not including voluntary
co-investment. CHIPS R&D reserves the right to make an award, multiple
awards, or no awards from this funding opportunity, subject to the availability
of funds and the merit of applications received.

Co-investment (cost share) Requirements: Co-investment
(cost share) is not required in this program. CHIPS R&D will, however, give
preference to applications that demonstrate committed co-investment in their
Project Narrative and Budget Narrative and Justification.




Database Key: 2126966159